Mainboard Gigabyte X570 AORUS PRO Socket AM4

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Mainboard Gigabyte X570 AORUS PRO Socket AM4

7.590.000 6.490.000

Tình trạng: Còn hàng

Bảo hành chính hãng 36 tháng 

  • Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • 12+2 Phases IR Digital VRM Solution with PowIRstage
  • Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
  • Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Dual Thermal Guards
  • ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with WIMA Audio Capacitors
  • Intel® Gigabit LAN with cFosSpeed Internet Accelerator
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
  • Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Front & Rear USB 3.1 Gen2 Type-C™ Header & HDMI 2.0 support
  • Integrated I/O Shield Armor
  • Q-Flash Plus update BIOS Without Installing CPU, Memory and Graphics card
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Thông tin bổ sung

CPU Support

AMD Ryzen Series

Chipset

AMD X570

Memory Support

DDR4

Graphic Support

1x HDMI

Audio

Realtek® ALC1200 codec

LAN

Intel® GbE LAN chip (10/100/1000 Mbit)

Multi-GPU

AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™

USB

4 x USB 3.2 Gen 1 ports on the back panel
1 x USB Type-C™ port with USB 3.2 Gen 2 support, available through the internal USB header
2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
4 x USB 3.2 Gen 1 ports available through the internal USB headers

Size

ATX Form Factor; 30.5cm x 24.4cm

GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE’s dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

AMD StoreMI Technology

GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system. 

The benefits of AMD StoreMI:

• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users’ computing behaviors

Detail information please refer AMD official website: https://www.amd.com/en/technologies/store-mi

AORUS PERFORMANCE
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
 

Advanced Thermal Design
X570 AORUS PRO reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch heatpipe to provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS PRO uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
Fins-Array
Multi-cut Heatsink
High Thermal Conductivity Pad

Direct Touch Heatpipe
Smart Chipset Fan Heatsink
Smart Fan
  1. Provides 3 different operating modes to minimize noise and extend the fan’s longevity. Silent, Balanced and Performance modes, choose the mode that suits you the best in any situation.
High Durability
    1. X570 motherboards adopt a high quality ball bearing fan which guarantees 60,000* working hours.
* MTBF, A standard measurement that continuously operates under certain criteria with 90 % of confidence level.

 

Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.
 

AORUS CONNECTIVITY
Next Generation Connectivity
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage to keep you up to speed.
 

AORUS AUDIO
High-End WIMA & Audio Capacitors
The AORUS motherboards boast a combination of Hi-Fi grade WIMA FKP2 capacitors and high-end Chemicon audio capacitors. While the high-end audio capacitors are suited for high-grade audio equipment, using state of the art technology to provide rich sound in the bass and clearer high frequencies, the WIMA FKP2 capacitors are being used widely in premium grade Hi-Fi systems. The addition of this to the exclusive AOURS AMP-UP Audio technology makes for the ideal onboard sound solution for the most demanding audiophiles.

 

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